Modernity tailored to your business

Contract assembly

Component and functional tests (ICT / FCT)

We will be your ideal business partner for handling large, medium and small production runs, also in the express channel like PROTO

ICT (In-Circuit Test) and FCT (Functional Circuit Test) are the two main types of test that are used to control the quality of the final contract electronics product.
ICT is a test performed on printed circuit boards to detect defects at the level of individual components or electrical connections. It is a test that uses special equipment called ICT testers that measure resistance, capacitance, impedance and inductance values.
FCT, on the other hand, is a test that aims to check the functionality of the entire device. It involves simulating the actual operating conditions of a device and checking that all its components are working properly and as required. Special test equipment is used for this purpose, which allows the simulation of various situations, such as a change in voltage, current or temperature.
 

Various testing devices are used in the testing process, such as the ICT tester, FCT tester, oscilloscopes, electrical magnitude meters, etc. Based on these devices, tests can be carried out to detect various problems, such as component failures, connection defects or malfunctions in the whole device.

Assembly

SMT, THT, manual assembly and soldering in complete lines and on modern machines, eliminating many manual operations and increasing efficiency.

Tests

Equipment for component and functional testing and functional tests based on systems SPEEA, Phillips MDA and FLUKE

Final assembly

Specialised final assembly stations for individual customers and products

Delivery

Efficient logistics system and full customs service for customers outside the European Union

We can help you create products that build a better world.

We guarantee that you will receive a product that meets 100% of your expectations

In our company, we use component and functional test equipment based on SPEA, Philips MDA and FLUKE systems. We work with test adapters and programmes made by our test department or provided by customers.

  • production batches from 1 product to large quantities in a batch
  • experience with complex projects and various industries 
  • high flexibility, and ability to increase production

  • production batches from 1 product to large quantities in a batch
  • experience with complex projects and various industries 
  • high flexibility, and ability to increase production

Printed circuit boards - PCB

  • standard circuits, aluminium, Teflon (PTFE), ceramic, CEM-1, CEM-3 various surface coatings
  • rigid or flexible, multilayer
  • storage, washing, protection, varnishing

Application of solder paste solder paste

  • in-line screen printers
  • step stencils
  • nickel stencils (2x higher strength)
  • steel stencils
  • universal and glued frames

Components

  • housings from 01005
  • Pin-in-paste technology
  • BGA/CSP, uBGA, QFP, uQFN stacking

Assembly

Spray brazing

  • standard circuits, aluminium, Teflon (PTFE), ceramic, CEM-1, CEM-3
  • various surface coatings
  • rigid or flexible, multilayer
  • storage, washing, protection, varnishing

AOI / SPI / X-RAY inspection

  • in-line screen printers
  • step stencils
  • nickel stencils (2x higher strength)
  • steel stencils
  • universal and glued frames

IC programming

  • housings from 01005
  • Pin-in-paste technology
  • BGA/CSP, uBGA, QFP, uQFN stacking

Do you have any questions? Get in touch with us

Our team of specialists is at your disposal and will be happy to answer any questions you may have.
We also encourage you to use our Virtual Advisor to send us a detailed enquiry.

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