Modernity tailored for your business

Contract assembly

SMD assembly

We will be your ideal business partner for handling large, medium and small production runs, including in the PROTO express channel

We offer professional SMD (Surface-Mount Devices) electronics assembly, which involves placing suitably adapted electronic components on a printed circuit board. Our offer is aimed at both customers ordering large production batches and those who need smaller quantities of products with varying degrees of complexity.
 

We have four modern and fast SMT assembly lines, equipped with SIPLACE SX, SIPLACE TX machines, among others, with DEK screen printers (paste or glue printing) and SPI paste control system. Our equipment and years of experience enable us to assemble components of varying complexity, including components from 01005, BGA/CSP, microBGA, MLF, Fine Pitch, as well as GSM, GPS, WiFi, Bluetooth modules.

Assembly

SMT, THT, manual assembly and soldering in complete lines and on modern machines, eliminating many manual operations and increasing efficiency.

Tests

Element and functional test equipment based on SPEEA, Phillips MDA and FLUKE systems

Final assembly

Specialized final assembly stations for specific customers and products

Delivery

Efficient logistics system and full customs service for customers outside the European Union

Pomożemy Ci stworzyć produkty, które budują lepszy świat.

We give you a guarantee that you will receive a product that 100% meets your expectations

Production capabilities

  • Production batches from 1 product piece to large quantities in a batch
  • experience with complex projects and various industries 
  • High flexibility, and ability to increase production

Production quality

  • Production batches from 1 product piece to large quantities in a batch
  • experience with complex projects and various industries 
  • High flexibility, and ability to increase production

Printed circuit boards - PCB

  • standard, aluminum, Teflon (PTFE), ceramic, CEM-1, CEM-3 circuits
  • various surface coatings
  • rigid or flexible, multilayer
  • storage, washing, protection, varnishing

Application of solder paste

  • in-line screen printers
  • stepped stencils
  • nickel stencils (2x higher strength)
  • steel stencils
  • universal and glued frames

Components

  • housings from 01005
  • Pin-in-Paste technology
  • BGA/CSP, uBGA, QFP, uQFN stacking

Assembly

Spray soldering

  • standard circuits, aluminum, Teflon (PTFE), ceramic, CEM-1, CEM-3
  • various surface coatings
  • rigid or flexible, multilayer
  • storage, washing, protection, varnishing

AOI / SPI / X-RAY inspection

  • in-line screen printers
  • stepped stencils
  • nickel stencils (2x higher strength)
  • steel stencils
  • universal and glued frames

IC programming

  • housings from 01005
  • Pin-in-Paste technology
  • BGA/CSP, uBGA, QFP, uQFN stacking

Do you have questions? Get in touch with us

Our team of specialists is at your disposal and we will be happy to answer any questions.
We also encourage you to use the Virtual Advisor to send us a detailed inquiry.

Contact