Modernity tailored to your business

Contract assembly

SPI and AOI control

We will be your ideal business partner for handling large, medium and small production runs, also in the express channel like PROTO

We offer automation of the assembly inspection process of electronic products, which not only saves time, but also enables more accurate removal of possible errors in the mass production process.
 

We offer automatic SPI control of the solder paste application process prior to SMT assembly. This allows us to guarantee the precision of the process, which affects the quality of the assembly. In addition, we offer an AOI optical inspection after surface mount assembly, which allows us to check the correctness of the assembly in terms of, among other things, rotation, polarity, missing components, detection of raised components. Our solutions allow errors to be quickly and effectively detected and corrected even before further stages of production, thus avoiding costly complaints.

Assembly

SMT, THT, manual assembly and soldering in complete lines and on modern machines, eliminating many manual operations and increasing efficiency.

Tests

Component and functional test equipment based on SPEEA, Phillips MDA and FLUKE systems

Final assembly

Specialised final assembly stations for individual customers and products

Delivery

Efficient logistics system and full customs service for customers outside the European Union

We can help you create products that build a better world.

We guarantee that you will receive a product that meets 100% of your expectations

Production capacity

  • production batches from 1 product to large quantities in a batch
  • experience with complex projects and various industries 
  • high flexibility, and ability to increase production

Production quality

  • production batches from 1 product to large quantities in a batch
  • experience with complex projects and various industries 
  • high flexibility, and ability to increase production

Printed circuit boards - PCB

  • standard circuits, aluminium, Teflon (PTFE), ceramic, CEM-1, CEM-3
  • various surface coatings
  • rigid or flexible, multilayer
  • storage, washing, protection, varnishing

Nakładanie pasty lutowniczej

  • in-line screen printers
  • step stencils
  • nickel stencils (2x higher strength)
  • steel stencils
  • universal and glued frames

Components

  • housings from 01005
  • Pin-in-paste technology
  • BGA/CSP, uBGA, QFP, uQFN stacking

Assembly

Spray brazing

  • standard circuits, aluminium, Teflon (PTFE), ceramic, CEM-1, CEM-3
  • various surface coatings
  • rigid or flexible, multilayer
  • storage, washing, protection, varnishing

AOI / SPI / X-RAY inspection

  • in-line screen printers
  • step stencils
  • nickel stencils (2x higher strength)
  • steel stencils
  • universal and glued frames

IC programming

  • housings from 01005
  • Pin-in-paste technology
  • BGA/CSP, uBGA, QFP, uQFN stacking

Do you have questions? Get in touch with us

Our team of specialists is at your disposal and will be happy to answer any questions you may have.
We also encourage you to use our Virtual Advisor to send us a detailed enquiry.

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