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Surface Mount Technology
Automated Through Hole Technology
Manual Assembly & Soldering
ICT / FCT Testing
Final Assembly
Delivery

Surface Mount Technology Surface Mount Technology (SMT)

 

  • Three SMT lines equipped with screen printer, glue dispenser and advanced assembly machines produced by SIPLACE and UIC
  • Assembly of chips:
    » Passives down to 0201,
    » BGA & Micro BGA placements,
    » Quad Flat Pack (QFP) to 12 mil pitch,
    » and others.

 

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Surface Mount Technology